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    • Semy Engineering, Inc. Open site in a new window - Manufacturer of data collection analysis and control systems for the global semiconductor industry.

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    • Flip Chip Technologies Open site in a new window - Offers wafer bumping services, wafer-level chip-scale packaging, redistribution of peripheral pads, test die and substrates, solder alloys, technology licensing, and more.

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      USA > Arizona > Phoenix > Electronics > Board Level Components

      Suggest a Site Advanced Search

      Directory > Regional > U.S. States > Arizona > Cities > Phoenix > Business and Shopping > Business to Business > Electronics > Board Level Components

      Save to My Web

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